| Name: | |
| Equipment: | Ekspla NL220 |
| Applications: | 3D microfabrication; micromoulds. Microfluidics. Surface ablation by thermal heating. In glass marking within 10cm depth. Ablation of immersed surfaces. |
| Properties: | 25 ns, 10 mJ @ 500 Hz; 532 or 1064 nm. 10 nm precission XYZ piezo stage (WA: 0,5x0,5x0,25 mm). |
| Tested materials: | |
| Category: | |
| Laboratory: | Lithuania - FTMC |
Specifications
| Method | Min feature size | Working area | Process speed |
| ns Ultrashort Pulse Laser Ablation | 15 µm (1:10 aspect ratio) 50 µm (1:1) |
20x20x5 cm | Material dependent 1000-100000 µm3/s |
| Laser Direct Writing | 3-5 µm | 20×20 cm | Up to 2 m/s with XYZ stages; 20 m/s with galvoscanners |
| Laser Beam Interference Ablation | Period ~ wavelength | 0.5×0.5×0,25 mm | 1000 µm2/shot |