| Name: | |
| Equipment: | ML100 |
| Applications: | 3D laser micromachining (Drilling, cutting, milling, marking, selective laser ablation |
| Properties: | Fix lens head, processing gas avalable. XYZ, rotation and tilt stages. Vision system TTL. |
| Tested materials: | Polymer, metals (Al, Cu, Fe, Ti, Mo, etc. ), Glasses, Thin film structures, Photonic crystals, Ceramics (aluminum oxide, etc.) |
| Category: | LASER WORKSTATIONS |
| Laboratory: | Spain - UPM |
Laser Spectra Physics HIPPO: DPSS Nd:YVO4 355 nm, Pulse-width ~15 ns 5-300 kHz, 5 W @ 50 kHz
Laser Excimer ATL Laser Lasertechnik SP300i: KrF excimer 248 nm. Pulse-width ~7 ns 300 Hz 5W @ 300 Hz. Mask projection
Specifications
| Method | Min feature size | Working area | Process speed |
| ns Ultrashort Pulse Laser Ablation | 10 µm spot diameter | 100x150x100 mm | 20 mm/s |
| ns Ultrashort Pulse Laser Ablation | 3.5 x 6 mm | 400x200x100 mm XYZ Scanner 100×100 mm | Stage XY : 0.5 m/s Scanner Head: 10 m/s |