| Name: | |
| Equipment: | Finetech Fineplacer Pico ma |
| Applications: | Die bonding. Multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. |
| Properties: | Bonding Force Module (manual), Substrate Heating Module Tmax=400 °C |
| Tested materials: | |
| Category: | |
| Laboratory: | Lithuania - FTMC |
