| Name: | |
| Equipment: | DirectPhotonics DirectBond 800 |
| Applications: | Laser annealing and crystallization. Adhesive curing. |
| Properties: | 808nm CW laser. 60W. Fiber coupled. Industrial XY stage. |
| Tested materials: | Silicon waffers, amorphous silicon. Conductive adhesives |
| Category: | LASER SOURCES |
| Laboratory: | Spain - UPM |
Specifications
| Method | Min feature size | Working area | Process speed |
| Laser Annealing | ~500µm spot diameter | 30×30 cm | 1500 mm/min |