| Name: | |
| Equipment: | AB200 |
| Applications: | 3D laser micromachining (Marking, cutting, drilling and laser ablation), Microfluidcs structures fabrication, Surface modification, Selective ablation, Cleaving of SM, Laser applications in photovoltaic industry (edge deletion and isolation, LFC, dielectric layer opening, thin films interconnection, BIPV, etc.) |
| Properties: | UV ns/ps (quasi-CW). Positioning system with 6 DOF Vision system TTL. Fix lens head Scanner head, XYZ llinear stages, rotation and tilt stages. |
| Tested materials: | Polymer, metals (Al, Cu, Fe, Ti, Mo, etc. ), glasses, thin film structures, photonic crystals, ceramics (aluminum oxide, etc.) |
| Category: | LASER WORKSTATIONS |
| Laboratory: | Spain - UPM |
Laser Spectra Physics Pulseo: DPSS Nd:YVO4, 1Hz-400 kHz, 20 W @100 kHz, pulse-width <20 ns
Laser Spectra Physics Vanguard: DPSS Nd:YVO 480 MHz, Power 2.5 W, pulse-width <10 ps.
Specifications
| Method | Min feature size | Working area | Process speed |
| ns Ultrashort Pulse Laser Ablation | ~20-40 µm spot diameter | 400x200x100 mm XYZ Scanner 100×100 mm | Stage XY : 0.5 m/s Scanner Head: 10 m/s |
| ps Ultrashort Pulse Laser Ablation | ~20-40 µm spot diameter | 400x200x100 mm XYZ Scanner 100×100 mm | Stage XY : 0.5 m/s Scanner Head: 10 m/s |