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Equipment: INNOLAS / Lumera Superapid
Applications: Thin film ablation Surface texturing Laser scribing. Laser cutting Laser Drilling. Laser applications in photovoltaic industry (edge deletion and isolation, LFC, dielectric layer opening, thin films interconnection, BIPV, etc.)
Properties: DPSS Nd:YVO4 1064 nm / 532 nm /355 nm Pulse-width ~8 ps 18W @1064 nm 8W @ 532 nm 4W @ 355 nm Fixed lens head with processing gas Scanner Head (all wavelenghts) XYZ stage.
Tested materials: c-Si Thin films (metals, semiconductors, OCTs, etc.) Metals Polymers
Laboratory: Spain - UPM
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Method Min feature size Working area Process speed
 ps Ultrashort Pulse Laser Ablation Fix lens~15 µm spot diameter Scanner : ~15 µm spot diameter Stage: 430x555x127mmScanner Field size: 200x200mm Stage XY :  1 m/sScanner Head: 8 m/s