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Equipment: Ekspla PL10100
Applications: Cutting, scribing and drilling of various materials with low thermal damage.
Properties: 10 ps, 10W @ 10kHz; galvanscanners for 1064, 532, 355 nm harmonics, XYZ stage for 266 nm available.
Tested materials: CIGS solar cell isolation trenches, ZrO2 patterning, cutting, drilling.
Laboratory: Lithuania - FTMC
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Method Min feature size Working area Process speed
 ps Ultrashort Pulse Laser Ablation with UV output 20-50 um spot size 10×10 cm 3 m/s