| Name: | |
| Equipment: | Ekspla PL10100 |
| Applications: | Cutting, scribing and drilling of various materials with low thermal damage. |
| Properties: | 10 ps, 10W @ 10kHz; galvanscanners for 1064, 532, 355 nm harmonics, XYZ stage for 266 nm available. |
| Tested materials: | CIGS solar cell isolation trenches, ZrO2 patterning, cutting, drilling. |
| Category: | |
| Laboratory: | Lithuania - FTMC |
Specifications
| Method | Min feature size | Working area | Process speed |
| ps Ultrashort Pulse Laser Ablation with UV output | 20-50 um spot size | 10×10 cm | 3 m/s |